We will exhibit at Nepcon Japan in the fall. ★Waterproof sealing methods for electrical components★
Waterproof sealing and insulation of electrical components using hot melt molding. Case studies will be presented at Nepcon Japan (Autumn) in September 2026.
A groundbreaking sealing method for waterproofing and dustproofing electronic components【Hot Melt Molding】 rapidly solidifies in just a few seconds, allowing for quick transition to the next process. Its high degree of freedom in shape and potential for miniaturization and lightweight design have led to its increasing adoption as an alternative method to two-component potting materials like urethane and epoxy. At Internepcon Japan (Autumn), we will showcase many products that have actually adopted this method. We look forward to your visit. ↓↓Exhibition Information↓↓ Internepcon Japan Autumn Venue: Makuhari Messe Dates: September 9 (Wednesday) to September 11 (Friday), 2026 ★★We sincerely await your visit.★★
- Company：Matsumoto kakou Co.,Ltd.
- Price：Other
